JEDEC JESD217A
$65.00
Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
Related products
$33.00
$25.00
$24.00
$26.00
$29.00
$29.00
$70.00
$33.00