JEDEC JESD217.01

As ball grid array component pitch continues to decrease, the need to characterize solder voiding has become more significant. Solder void manifestation (type and/or sizes) has been used to determine process capability as a means of quality assurance during process transfer, and as indicators of process stability from in-line manufacturing monitors. This document describes how to characterize voids in solder spheres in ball grid array packages prior to surface-mount (SMT) reflow soldering.