The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
JEDEC J-STD-020F
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JOINT IPC/JEDEC STANDARD FOR Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
Category: JEDEC
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