IEC 62047-16 Ed. 1.0 b:2015
$25.00
Semiconductor devices – Micro-electromechanical devices – Part 16: Test methods for determining residual stresses of MEMS films – Wafer curvature and cantilever beam deflection methods
IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 μ to 10 μ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
Related products
$17.00
$47.00
$139.00
$72.00
$41.00
$25.00
$41.00