Determines the suitability of press-in connections under specified mechanical, electrical and atmospheric conditions. Is applicable to solderless press-in connections for use in telecommunication equipment and in electronic devices employing similar techniques. Changes with respect to the previous edition deal with: use of four layer test boards; sample tolerance range requirements; use of platings other than tin or tin/lead.
IEC 60352-5 Ed. 3.0 b:2008
$94.00
Solderless connections – Part 5: Press-in connections – General requirements, test methods and practical guidance
Category: IEC