IEC 60191-6-8 Ed. 1.0 en:2001
$31.00
Mechanical standardization of semiconductor devices – Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for glass sealed ceramic quad flatpack (G-QFP)
Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.
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