IEC 60191-6-5 Ed. 1.0 en:2001
$25.00
Mechanical standardization of semiconductor devices – Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch ball grid array (FBGA)
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch ball grid array the terminal pitch of which is less than or equal to 0,80 mm.
Related products
$25.00
$47.00
$12.00
$41.00
$227.00
$117.00
$169.00
$23.00