IEC 60191-6-18 Ed. 1.0 b:2010
$72.00
Mechanical standardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)
IEC 60191-6-18:2010 provides standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.
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