IEC 60191-6-18 Ed. 1.0 b COR. 1:2010

Name: IEC 60191-6-18 Ed. 1.0 b COR. 1:2010 - REALSTD
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$60.00

Corrigendum 1 – Mechanical stardardization of semiconductor devices – Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for ball grid array (BGA)