IEC 60191-6-12 Ed. 1.0 en:2002
$50.00
Mechanical standardization of semiconductor devices – Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Design guide for fine-pitch land grid array (FLGA) – Rectangular type
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.
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