BS PD IEC/TS 62647-4:2018

BS PD IEC/TS 62647-4:2018, which is a Technical Specification, defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products.

Cross References:

IEC 62668

IEC TR 61340-5-2

JEDEC JESD625

IPC J-STD-004

IPC-TM-650 number 2.3.25

ECA/IPC/JEDEC J-STD-075

JEDEC JESD22-B117

IPC J-STD-005

IPC/JEDEC J-STD-020

IPC/JEDEC J-STD-033

JEDEC JESD22-B107

AEC-Q100-010

ANSI/ESD S20.20

IEC 62090

IPC J-STD-002

JEDEC JESD22-B101

IPC J-STD-001xS

IPC J-STD-001

MIL-STD-883

IPC/JEDEC J-STD-035

SAE AS5553

JEDEC JESD213

JEDEC JESD22-A101

IEC 61340-5-1

JEDEC J-STD-046

IEC TS 62647-21:2013

IEC TS 62668-1:2016

IEC TS 62647-2:2012

IEC TS 62647-22:2013

IEC TS 62647-3:2014

EIA-STD-4899

ISO/IEC 17050-1

MIL-PRF-38535

IEC TS 62647-23

IEC 62647

IPC-7711/7721

IDEA-STD-1010

JEDEC JESD22-B112

MIL-PRF-19500

JEDEC JESD22-A104

AS/EN/JISQ 9100

MIL-PRF-38534

IEC TS 62239-1

IPC-TM-650 number 2.3.28

IEC TS 62668-2

IEC TS 62647-1

JESD22-B108

All current amendments available at time of purchase are included with the purchase of this document.