This part of IEC 62878 is applicable to device embedded substrates fabricated by use of organic base material, which include for example active or passive devices, discrete components formed in the fabrication process of electronic wiring board, and sheet formed components.
The IEC 62878 series does not apply to the re-distribution layer (RDL) nor to the electronic modules defined as an M-type business model in IEC 62421.
Cross References:
IEC 62878-1
All current amendments available at time of purchase are included with the purchase of this document.