ASTM F459-13
$29.00
Standard Test Methods for Measuring Pull Strength of Microelectronic Wire Bonds
1.2These test methods can be used only when the loop height of the wire bond is large enough to allow a suitable hook for pulling (see Fig. 1) to be placed under the wire.
1.3The precision of these methods has been evaluated for aluminum ultra-sonic wedge bonds; however, these methods can be used for gold and copper wedge or ball bonds.2
1.4These methods are destructive. They are appropriate for use in process development or, with a proper sampling plan, for process control or quality assurance.
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