This recommended practice describes the materials, related equipment, and particular processing techniques utilized in process science curing of composite hardware where pressure is imparted specifically to the resin of curing composites. Included as Appendix “A” to this ARP is a discussion of the particular techniques developed for a processing science philosophy which has consistently produced void and porosity-free, large area, thick composite structures. An understanding of the processing philosophy presented in Appendix “A” is important because the approaches and techniques used in processing composite hardware presented in this ARP are unique compared to normal industry practice.
SAE ARP1927
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Application of Direct Pressure to Resin in Curing of Epoxy and Addition Type Polyimides
Category: SAE
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