JEDEC J-STD-033C

The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damage from the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlife exposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary to avoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedure and JEP113 defines the labeling requirements.