IPC 4555
$59.00
Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
This performance specification sets requirements for High Temperature Organic Solderability Preservatives (OSP-High Temperature) for Pb-free soldering. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) and original equipment manufacturers (OEM).
Related products
$187.00
$125.00
$187.00
$71.00
$346.00
$85.00
$80.00
$38.00