This Material and Process Characterization/Qualification Test records changes in Surface Insulation Resistance (SIR) on a representative sample of a printed circuit assembly (PCA). It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electro-chemical reactions that grossly affect reliability.
IPC 9202A
$50.00
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance Using the IPC-B-52 Test Assembly
Category: IPC
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