IPC 6010-Series

The IPC-6010 series includes IPC’s current qualification and performance specification standards for all major types of printed boards. The series includes IPC-6011, the base document, which includes all generic requirements for printed boards, regardless of substrate. The IPC-6011 is supplemented by the appropriate sectional performance specification: IPC-6012, Qualification and Performance Specification for Rigid Printed Boards; IPC-6013, Qualification and Performance Specification for Flexible Printed Boards; IPC-6015, Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures; IPC-6016, Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards; IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices; and IPC-6018A, Microwave End Product Board Inspection and Test. The specifications provide surface plating/coating criteria, hole plating integrity requirements, solder mask and covercoat coverage requirements, and quality assurance provisions that include test sample frequencies and lot inspection.