IEC 60191-6-3 Ed. 1.0 b:2000
$72.00
Mechanical standardization of semiconductor devices – Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages – Measuring methods for package dimensions of quad flat packs (QFP)
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
Related products
$117.00
$63.00
$93.00
$23.00
$47.00
$17.00
$118.00